RE331-LF | Roth Elektronik
Multibus II board, RE331-LF, 100 x 220 mm, epoxy resin
Multibus II boards, type Roth Elektronik RE331-LF.
For multibus II modules, single-sided, 35 µm copper plating, option for installing connectors to DIN 41612 design C (32-, 64- and 96-pole); Grid: 2.54 x 2.54 mm. Hole matrix: 32 x 81 solder lands. Diameter of solder lands: 2.0 mm. Hole diameter: 1.0 mm. Material: epoxy resin FR 4, hot-tinned (HAL lead-free). Board thickness: 1.5 mm. Format: 100 x 220 mm.
Type: RE331-LF, 100 x 220 mm, epoxy resin
Version | lab board | |
Width | 220 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |